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| september 2006 hys72t32000hp?[3s/3.7]?a HYS72T64001HP?[3s/3.7]?a hys72t64020hp?[3s/3.7]?a 240-pin registered ddr2 sdram modules ddr2 sdram rdimm sdram rohs compilant internet data sheet rev. 1.01
we listen to your comments any information within this document that yo u feel is wrong, unclear or missing at all? your feedback will help us to continuous ly improve the quality of this document. please send your proposal (including a reference to this document) to: techdoc@qimonda.com internet data sheet hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules qag_techdoc_rev400 / 3.2 qag / 2006-07-21 2 03292006-zzhp-pr83 hys72t32000hp?[3s/3.7]?a, HYS72T64001HP? [3s/3.7]?a, hys72t64020hp?[3s/3.7]?a revision history: 2006-09, rev. 1.01 page subjects (major chan ges since last revision) all qimonda update all adapted internet edition 24 modified ac timing parameters previous revision: 2006-03, rev. 1.0 internet data sheet rev. 1.01, 2006-09 3 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 1overview this chapter gives an overview of the 240-pin registered ddr2 sdram modules wit h parity bit product family and describes its main characteristics. 1.1 features ? 240-pin pc2?5300 and pc2?4200 ddr2 sdram memory modules. ? one rank in 32m 72, 64m x 72 and two rank in 64m 72 module organization and 32m 8, 64m 4 chip organization ? 256m, 512 mbyte modules are built with 256-mbit ddr2 sdrams in p-tfbga-60 chipsize packages. ? standard double-data-rate-two synchronous drams (ddr2 sdram) with a single + 1.8 v ( 0.1 v) power supply ? all speed grades faster than ddr2-400 comply with ddr2-400 timing specifications as well. ? registered dimm with parity bit for address and control bus ? programmable cas latencies (3, 4 and 5), burst length (4 & 8) and burst type ? auto refresh (cbr) and self refresh ? average refresh period 7.8 s at a t lower than 85 c, 3.9 s between 85 c and 95 c ? programmable self refres h rate via emrs2 setting ? all inputs and outputs sstl_18 compatible ? off-chip driver impedance adjustment (ocd) and on-die termination (odt) ? serial presence detect with e 2 prom ? based on standard reference layouts raw cards ?f?, ?g? and ?h? ? rdimm with parity bit dimensions (nominal): 30.00 mm high, 133.35 mm wide ? rohs compliant products 1) table 1 performance table for ?3s 1) rohs compliant product: restriction of the use of certain hazar dous substances (rohs) in el ectrical and electronic equipment as defined in the directive 2002/95/ec issued by the european parliament and of the council of 27 january 2003. these substances include m ercury, lead, cadmium, hexavalent chromium, polybro minated biphenyls and polybrominated biphenyl ethers. product type speed code ?3s unit speed grade pc2?5300 5?5?5 ? max. clock frequency @cl5 f ck5 333 mhz @cl4 f ck4 266 mhz @cl3 f ck3 200 mhz min. ras-cas-delay t rcd 15 ns min. row precharge time t rp 15 ns min. row active time t ras 45 ns min. row cycle time t rc 60 ns internet data sheet rev. 1.01, 2006-09 4 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules table 2 performance table for ?3.7 table 3 performance table for ?5 product type speed code ?3.7 unit speed grade pc2?4200 4?4?4 ? max. clock frequency @cl5 f ck5 266 mhz @cl4 f ck4 266 mhz @cl3 f ck3 200 mhz min. ras-cas-delay t rcd 15 ns min. row precharge time t rp 15 ns min. row active time t ras 45 ns min. row cycle time t rc 60 ns product type speed code ?5 units speed grade pc2?3200 3?3?3 ? max. clock frequency @cl5 f ck5 200 mhz @cl4 f ck4 200 mhz @cl3 f ck3 200 mhz min. ras-cas-delay t rcd 15 ns min. row precharge time t rp 15 ns min. row active time t ras 40 ns min. row cycle time t rc 55 ns internet data sheet rev. 1.01, 2006-09 5 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 1.2 description the qimonda hys72t[32/64] xxxhp?[3s/3.7]?a module family are registered dimm (rdimm with parity) with 30.00 mm height based on ddr2 technology. dimms are available as ecc modules in 32m 72 (256 mbyte) and 64m x 72 (512 mbyte) organization and density, intended for mounting into 240-pin connector sockets. the memory array is designed with 256-mbit double-data- rate-two (ddr2) synchronous drams. all control and address signals are re-driven on the dimm using register devices and a pll for the clock distribution. this reduces capacitive loading to the system bus, but adds one cycle to the sdram timing. decoupling capacitors are mounted on the pcb board. the dimms feat ure serial presence detect based on a serial e 2 prom device using the 2-pin i 2 c protocol. the first 128 bytes are programmed with configuration data and the second 128 bytes are available to the customer. table 4 ordering information for rohs compliant products table 5 address format product type 1) 1) all product types end with a place code, designating the silicon die re vision. example: hys72t64020hp?3.7?a, indicating rev. ?a? dies are used for ddr2 sdram components. for all qi monda ddr2 module and component nomenclature see chapter 6 of this data sheet. compliance code 2) 2) the compliance code is printed on the module label and describes the speed grade, for example ?pc2?4200p?444?12?g0?, where 4200p means very low profile registered dimm modules with 4. 26 gb/sec module bandwidth and ?444-12? means column address strobe (cas) latency = 4, row column delay (rcd) latency = 4 and row precharge (rp) latency = 4 using the latest jedec spd revision 1.2 and produced on the raw card ?g? description sdram technology pc2-5300 hys72t32000hp?3s?a 256mb 1r 8 pc2?5300p?555?12?f0 1 rank, ecc 256 mbit ( 8) HYS72T64001HP?3s?a 512mb 1r 4 pc2?5300p?555?12?h0 1 rank, ecc 256 mbit ( 4) hys72t64020hp?3s?a 512mb 2r 8 pc2?5300p?555?12?g0 2 rank, ecc 256 mbit ( 8) pc2-4200 hys72t32000hp?3.7?a 256mb 1r 8 pc2?4200p?444?12?f0 1 rank, ecc 256 mbit ( 8) HYS72T64001HP?3.7?a 512mb 1r 4 pc2?4200p?444?12?h0 1 rank, ecc 256 mbit ( 4) hys72t64020hp?3.7?a 512mb 2r 8 pc2?4200p?444?12?g0 2 rank, ecc 256 mbit ( 8) dimm density module organization memory ranks ecc/ non-ecc # of sdrams # of row/bank/columns bits raw card 256 mb 32m 72 1 ecc 9 13/2/10 f 512 mb 64m 72 1 ecc 18 13/2/11 h 512 mb 64m 72 2 ecc 18 13/2/10 g internet data sheet rev. 1.01, 2006-09 6 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules table 6 components on modules product type 1) 1) green product dram components 1) dram density dram organization note 2) 2) for a detailed description of all avail able functions of the dram components on these modules see the component data sheet. hys72t32000hp hyb18t256800af 256 mbit 32m 8 HYS72T64001HP hyb18t256400af 256 mbit 64m 4 hys72t64020hp hyb18t256800af 256mbit 32m 8 internet data sheet rev. 1.01, 2006-09 7 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 2 pin configuration this chapter contains the pin configuration and block diagrams. 2.1 pin configuration the pin configuration of the registered ddr2 sdram dimm is listed by function in table 7 (240 pins). the abbreviations used in columns pin and buffer type are explained in table 8 and table 9 respectively. the pin numbering is depicted in figure 1 . table 7 pin configuration of rdimm ball no. name pin type buffer type function clock signals 185 ck0 i sstl clock signal ck0, comple mentary clock signal ck0 186 ck0 isstl 52 cke0 i sstl clock enables 1:0 note: 2-ranks module 171 cke1 i sstl nc nc ? not connected note: 1-rank module control signals 193 s0 isstl chip select rank 1:0 note: 2-ranks module 76 s1 isstl nc nc ? not connected note: 1-rank module 192 ras isstl row address strobe (ras), column address strobe (cas), write enable (we) 74 cas isstl 73 we isstl 18 reset icmos register reset address signals 71 ba0 i sstl bank address bus 1:0 190 ba1 i sstl 54 ba2 i sstl bank address bus 2 nc i sstl not connected internet data sheet rev. 1.01, 2006-09 8 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 188 a0 i sstl address bus 12:0, address signal 10/autoprecharge 183 a1 i sstl 63 a2 i sstl 182 a3 i sstl 61 a4 i sstl 60 a5 i sstl 180 a6 i sstl 58 a7 i sstl 179 a8 i sstl 177 a9 i sstl 70 a10 i sstl ap i sstl 57 a11 i sstl 176 a12 i sstl 196 a13 i sstl address signal 13 nc nc ? not connected 174 a14 i sstl address signal 14 nc nc ? not connected 173 a15 i sstl address signal 14 nc nc ? not connected ball no. name pin type buffer type function internet data sheet rev. 1.01, 2006-09 9 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules data signals 3 dq0 i/o sstl data bus 63:0 4 dq1 i/o sstl 9 dq2 i/o sstl 10 dq3 i/o sstl 122 dq4 i/o sstl 123 dq5 i/o sstl 128 dq6 i/o sstl 129 dq7 i/o sstl 12 dq8 i/o sstl 13 dq9 i/o sstl 21 dq10 i/o sstl 22 dq11 i/o sstl 131 dq12 i/o sstl 132 dq13 i/o sstl 140 dq14 i/o sstl 141 dq15 i/o sstl 24 dq16 i/o sstl 25 dq17 i/o sstl 30 dq18 i/o sstl 31 dq19 i/o sstl 143 dq20 i/o sstl 144 dq21 i/o sstl 149 dq22 i/o sstl 150 dq23 i/o sstl 33 dq24 i/o sstl 34 dq25 i/o sstl 39 dq26 i/o sstl 40 dq27 i/o sstl 152 dq28 i/o sstl 153 dq29 i/o sstl 158 dq30 i/o sstl 159 dq31 i/o sstl 80 dq32 i/o sstl 81 dq33 i/o sstl 86 dq34 i/o sstl 87 dq35 i/o sstl 199 dq36 i/o sstl 200 dq37 i/o sstl 205 dq38 i/o sstl ball no. name pin type buffer type function internet data sheet rev. 1.01, 2006-09 10 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 206 dq39 i/o sstl data bus 63:0 89 dq40 i/o sstl 90 dq41 i/o sstl 95 dq42 i/o sstl 96 dq43 i/o sstl 208 dq44 i/o sstl 209 dq45 i/o sstl 214 dq46 i/o sstl 215 dq47 i/o sstl 98 dq48 i/o sstl 99 dq49 i/o sstl 107 dq50 i/o sstl 108 dq51 i/o sstl 217 dq52 i/o sstl 218 dq53 i/o sstl 226 dq54 i/o sstl 227 dq55 i/o sstl 110 dq56 i/o sstl 111 dq57 i/o sstl 116 dq58 i/o sstl 117 dq59 i/o sstl 229 dq60 i/o sstl 230 dq61 i/o sstl 235 dq62 i/o sstl 236 dq63 i/o sstl check bits 42 cb0 i/o sstl check bits 7:0 43 cb1 i/o sstl 48 cb2 i/o sstl 49 cb3 i/o sstl 161 cb4 i/o sstl 162 cb5 i/o sstl 167 cb6 i/o sstl 168 cb7 i/o sstl ball no. name pin type buffer type function internet data sheet rev. 1.01, 2006-09 11 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules data strobe bus 7 dqs0 i/o sstl data strobes 17:0 6 dqs0 i/o sstl 16 dqs1 i/o sstl 15 dqs1 i/o sstl 28 dqs2 i/o sstl 27 dqs2 i/o sstl 37 dqs3 i/o sstl 36 dqs3 i/o sstl 84 dqs4 i/o sstl 83 dqs4 i/o sstl 93 dqs5 i/o sstl 92 dqs5 i/o sstl 105 dqs6 i/o sstl 104 dqs6 i/o sstl 114 dqs7 i/o sstl 113 dqs7 i/o sstl 46 dqs8 i/o sstl 45 dqs8 i/o sstl 125 dqs9 i/o sstl 126 dqs9 i/o sstl 134 dqs10 i/o sstl 135 dqs10 i/o sstl 146 dqs11 i/o sstl 147 dqs11 i/o sstl 155 dqs12 i/o sstl 156 dqs12 i/o sstl 202 dqs13 i/o sstl 203 dqs13 i/o sstl 211 dqs14 i/o sstl 212 dqs14 i/o sstl 223 dqs15 i/o sstl 224 dqs15 i/o sstl 232 dqs16 i/o sstl 233 dqs16 i/o sstl 164 dqs17 i/o sstl 165 dqs17 i/o sstl ball no. name pin type buffer type function internet data sheet rev. 1.01, 2006-09 12 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules data mask 125 dm0 i sstl data masks 8:0 note: 8 based module 134 dm1 i sstl 146 dm2 i sstl 155 dm3 i sstl 202 dm4 i sstl 211 dm5 i sstl 223 dm6 i sstl 232 dm7 i sstl 164 dm8 i sstl eeprom 120 scl i cmos serial bus clock 119 sda i/o od serial bus data 239 sa0 i cmos serial address select bus 2:0 240 sa1 i cmos 101 sa2 i cmos parity 55 err_out ocmos parity bits par_in i cmos power supplies 1 v ref ai ? i/o reference voltage 238 v ddspd pwr ? eeprom power supply 51, 56, 62, 72, 75, 78, 170, 175,, 181, 191, 194 v ddq pwr ? i/o driver power supply 53, 59, 64, 67, 69, 172, 178, 184,, 187, 189, 197 v dd pwr ? power supply 2, 5, 8, 11, 14, 17, 20, 23, 26, 29, 32, 35, 38, 41, 44, 47, 50, 65, 66, 79, 82, 85, 88, 91, 94, 97, 100, 103, 106, 109, 112, 115, 118, 121, 124, 127, 130, 133, 136, 139, 142, 145, 148, 151, 154, 157, 160, 163, 166, 169, 198, 201, 204, 207, 210, 213, 216, 219, 222, 225, 228, 231, 234, 237 v ss gnd ? ground plane ball no. name pin type buffer type function internet data sheet rev. 1.01, 2006-09 13 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules table 8 abbreviations for buffer type table 9 abbreviations for pin type other pins 19, 55, 68, 102, 137, 138, 173, 220, 221 nc nc ? not connected 195 odt0 i sstl on-die termination control 1:0 note: 2-ranks module 77 odt1 i sstl nc nc ? note: 1-rank modules abbreviation description sstl serial stub terminated logic (sstl_18) cmos cmos levels od open drain. the corresponding pin has 2 ope rational states, active low and tristate, and allows multiple devices to share as a wire-or. abbreviation description i standard input-only pin. digital levels. o output. digital levels. i/o i/o is a bidirectio nal input/output signal. ai input. analog levels. pwr power gnd ground nu not usable nc not connected ball no. name pin type buffer type function internet data sheet rev. 1.01, 2006-09 14 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules figure 1 pin configuration for rdimm (240 pins) 0 3 3 7 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 9 5 ( ) ' 4 9 6 6 ' 4 6 ' 4 9 6 6 ' 4 ' 4 6 9 6 6 1 & 9 6 6 ' 4 ' 4 6 9 6 6 ' 4 ' 4 9 6 6 ' 4 6 5 ( 6 ( 7 9 6 6 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q ' 4 ' 4 9 6 6 ' 4 6 ' 4 9 6 6 ' 4 ' 4 6 9 6 6 ' 4 & % 9 6 6 ' 4 6 & % 9 6 6 & . ( 1 & % $ 9 ' ' 4 $ $ 9 ' ' 4 9 ' ' 9 6 6 1 & $ $ 3 9 ' ' 4 & $ 6 1 & 6 9 ' ' 4 ' 4 9 6 6 ' 4 6 ' 4 9 6 6 ' 4 ' 4 6 9 6 6 ' 4 ' 4 9 6 6 1 & ' 4 6 9 6 6 ' 4 ' 4 9 6 6 ' 4 6 ' 4 9 6 6 6 & / 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q ' 4 9 6 6 ' 4 ' 4 6 9 6 6 ' 4 ' 4 9 6 6 ' 4 6 ' 4 9 6 6 & % ' 4 6 9 6 6 & % 9 ' ' 4 9 ' ' 1 & $ 9 ' ' $ $ 9 6 6 9 ' ' 9 ' ' % $ : ( 9 ' ' 4 1 & 2 ' 7 9 6 6 ' 4 ' 4 6 9 6 6 ' 4 ' 4 9 6 6 ' 4 6 ' 4 9 6 6 ' 4 6 $ 9 6 6 ' 4 6 ' 4 9 6 6 ' 4 ' 4 6 9 6 6 ' 4 6 ' $ 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 9 6 6 ' 4 ' 0 ' 4 6 9 6 6 ' 4 ' 4 9 6 6 1 & ' 4 6 1 & 9 6 6 ' 4 9 6 6 1 & ' 4 6 ' 4 9 6 6 ' 4 ' 0 ' 4 6 9 6 6 1 & ' 4 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 9 6 6 ' 4 ' 0 ' 4 6 9 6 6 ' 4 ' 4 9 6 6 1 & ' 4 6 ' 4 9 6 6 & % ' 0 ' 4 6 9 6 6 & % 9 ' ' 4 9 ' ' 1 & $ $ 9 ' ' $ $ 9 ' ' & . $ % $ 5 $ 6 9 ' ' 4 1 & $ 9 6 6 ' 4 ' 0 ' 4 6 9 6 6 ' 4 ' 4 9 6 6 1 & ' 4 6 ' 4 9 6 6 ' 4 1 & 9 6 6 1 & ' 4 6 ' 4 9 6 6 ' 4 ' 0 ' 4 6 9 6 6 ' 4 9 ' ' 6 3 ' 6 $ 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q 3 l q ' 4 ' 4 9 6 6 1 & ' 4 6 ' 4 9 6 6 ' 4 ' 0 ' 4 6 9 6 6 ' 4 & % 9 6 6 1 & ' 4 6 & % 9 6 6 1 & & . ( 1 & $ 9 ' ' 4 $ $ 9 ' ' 4 $ & . 9 ' ' 9 ' ' 9 ' ' 4 6 2 ' 7 9 ' ' ' 4 9 6 6 1 & ' 4 6 ' 4 9 6 6 ' 4 ' 0 ' 4 6 9 6 6 ' 4 ' 4 9 6 6 1 & ' 0 ' 4 6 9 6 6 ' 4 ' 4 9 6 6 1 & ' 4 6 ' 4 9 6 6 6 $ ) 5 2 1 7 6 , ' ( % $ & . 6 , ' ( internet data sheet rev. 1.01, 2006-09 15 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 3 electrical characteristics this chapter lists the el ectrical characteristics. 3.1 absolute maximum ratings caution is needed not to exceed absolute maximum ratings of the dram device listed in table 10 at any time. table 10 absolute maximum ratings attention: stresses greater than those listed under ?abs olute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functi onal operation of the device at these or any other conditions above those indicated in the operational sect ions of this specification is not implied. exposure to absolute maximum rating conditions fo r extended periods may affect reliability. table 11 dram component operating temperature range symbol parameter rating unit note min. max. v dd voltage on v dd pin relative to v ss ?1.0 +2.3 v 1) 1) when v dd and v ddq and v ddl are less than 500 mv; v ref may be equal to or less than 300 mv. v ddq voltage on v ddq pin relative to v ss ?0.5 +2.3 v 1)2) v ddl voltage on v ddl pin relative to v ss ?0.5 +2.3 v 1)2) v in , v out voltage on any pin relative to v ss ?0.5 +2.3 v 1) t stg storage temperature ?55 +100 c 1)2) 2) storage temperature is the case surface temperature on the center/top side of the dram. symbol parameter rating unit note min. max. t oper operating temperature 0 95 c 1)2)3)4) 1) operating temperature is the case surface te mperature on the center / top side of the dram. 2) the operating temperature range are the temperatures where all dram specification will be supported. during operation, the dr am case temperature must be maintained between 0 - 95 c under all other specification parameters. 3) above 85 c the auto-refresh command interval has to be reduced to t refi = 3.9 s 4) when operating this product in the 85 c to 95 c tcase tem perature range, the high temperature self refresh has to be enable d by setting emr(2) bit a7 to ?1?. when the high temperatur e self refresh is enabled there is an increase of i dd6 by approximately 50% internet data sheet rev. 1.01, 2006-09 16 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 3.2 dc operating conditions this chapter describes the dc characteristics. table 12 operating conditions table 13 supply voltage levels an d dc operating conditions parameter symbol values unit note min. max. operating temperature (ambient) t opr 0+65 c dram case temperature t case 0+95 c 1)2)3)4) 1) dram component case temperature is the surface temperature in the center on the top side of any of the drams. 2) within the dram component case temperature range all dram specificat ions will be supported 3) above 85 c dram case temperature the auto-refresh command interval has to be reduced to t refi = 3.9 s 4) when operating this product in the 85 c to 95 c t case temperature range, the high temperature self refresh has to be enabled by setting emr(2) bit a7 to ?1?. when the high temperatur e self refresh is enabled there is an increase of i dd6 by approximately 50%. storage temperature t stg ? 50 +100 c barometric pressure (operating & storage) pbar +69 +105 kpa 5) 5) up to 3000 m. operating humidity (relative) h opr 10 90 % parameter symbol values unit note min. typ. max. device supply voltage v dd 1.7 1.8 1.9 v output supply voltage v ddq 1.7 1.8 1.9 v 1) 1) under all conditions, v ddq must be less than or equal to v dd input reference voltage v ref 0.49 v ddq 0.5 v ddq 0.51 v ddq v 2) 2) peak to peak ac noise on v ref may not exceed 2% v ref (dc). v ref is also expected to track noise in v ddq . spd supply voltage v ddspd 1.7 ? 3.6 v dc input logic high v ih(dc) v ref + 0.125 ? v ddq +0.3 v dc input logic low v il (dc ) ? 0.30 ? v ref ? 0.125 v in / output leakage current i l ? 5 ? 5 a 3) 3) input voltage for any connector pin under test of 0 v v in v ddq + 0.3 v; all other pins at 0 v. current is per pin internet data sheet rev. 1.01, 2006-09 17 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 3.3 ac characteristics this chapter describes the ac characteristics. 3.3.1 speed grades definitions this chapter contains the speed grade definition tables. table 14 speed grade definition speed bins for ddr2?667d table 15 speed grade definition speed bins for ddr2?533c speed grade ddr2?667d unit notes ifx sort name ?3s cas-rcd-rp latencies 5?5?5 t ck parameter symbol min. max. ? clock frequency @ cl = 3 t ck 58ns 1)2)3)4) 1) timings are guaranteed with ck/ck differential slew rate of 2.0 v/ns. for dqs si gnals timings are guaranteed with a differential slew rate of 2.0 v/ns in differential strobe mode and a slew rate of 1 v/ns in single ended mode.timings are further guaranteed for normal ocd drive strength (emrs(1) a1 = 0) 2) the ck/ck input reference level (for timing reference to ck/ck ) is the point at which ck and ck cross. the dqs / dqs , rdqs / rdqs , input reference level is the crosspoint when in differential strobe mode 3) inputs are not recognized as valid until v ref stabilizes. during the period before v ref stabilizes, cke = 0.2 x v ddq is recognized as low. 4) the output timing reference voltage level is v tt . @ cl = 4 t ck 3.75 8 ns 1)2)3)4) @ cl = 5 t ck 38ns 1)2)3)4) row active time t ras 45 70000 ns 1)2)3)4)5) 5) t ras.max is calculated from the maximum amount of time a ddr2 dev ice can operate without a refresh command which is equal to 9 x t refi . row cycle time t rc 60 ? ns 1)2)3)4) ras-cas-delay t rcd 15 ? ns 1)2)3)4) row precharge time t rp 15 ? ns 1)2)3)4) speed grade ddr2?533c unit note ifx sort name ?3.7 cas-rcd-rp latencies 4?4?4 t ck parameter symbol min. max. ? clock frequency @ cl = 3 t ck 58 ns 1)2)3)4) @ cl = 4 t ck 3.75 8 ns 1)2)3)4) @ cl = 5 t ck 3.75 8 ns 1)2)3)4) row active time t ras 45 70000 ns 1)2)3)4)5) row cycle time t rc 60 ? ns 1)2)3)4) internet data sheet rev. 1.01, 2006-09 18 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules ras-cas-delay t rcd 15 ? ns 1)2)3)4) row precharge time t rp 15 ? ns 1)2)3)4) 1) timings are guaranteed with ck/ck differential slew rate of 2.0 v/ns. for dqs si gnals timings are guaranteed with a differential slew rate of 2.0 v/ns in differential strobe mode and a slew rate of 1 v/ns in single ended mode.timings are further guaranteed for normal ocd drive strength (emrs(1) a1 = 0) 2) the ck/ck input reference level (for timing reference to ck/ck ) is the point at which ck and ck cross. the dqs / dqs , rdqs / rdqs , input reference level is the crosspoint when in differential strobe mode. 3) inputs are not recognized as valid until v ref stabilizes. during the period before v ref stabilizes, cke = 0.2 x v ddq is recognized as low. 4) the output timing reference voltage level is v tt . 5) t ras.max is calculated from the maximum amount of time a ddr2 devic e can operate without a refresh command which is equal to 9 x t refi . speed grade ddr2?533c unit note ifx sort name ?3.7 cas-rcd-rp latencies 4?4?4 t ck parameter symbol min. max. ? internet data sheet rev. 1.01, 2006-09 19 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 3.3.2 ac timing parameters this chapter contains t he ac timing parameters. table 16 timing parameter by speed grade - ddr2?667 parameter symbol ddr2?667 unit note 1)2)3)4)5)6)7) 8) min. max. dq output access time from ck / ck t ac ?450 +450 ps 9) dqs output access time from ck / ck t dqsck ?400 +400 ps 1) average clock high pulse width t ch.avg 0.48 0.52 t ck.avg 10)11) average clock low pulse width t cl.avg 0.48 0.52 t ck.avg 10)11) average clock period t ck.avg 3000 8000 ps dq and dm input setup time t ds.base 100 ?? ps 12)13)14) dq and dm input hold time t dh.base 175 ?? ps 1)1)15) control & address input pulse width for each input t ipw 0.6 ? t ck.avg dq and dm input pulse width for each input t dipw 0.35 ? t ck.avg data-out high-impedance time from ck / ck t hz ? t ac.max ps 1)16) dqs/dqs low-impedance time from ck / ck t lz.dqs t ac.min t ac.max ps 1)1) dq low impedance time from ck/ck t lz.dq 2x t ac.min t ac.max ps 1)1) dqs-dq skew for dqs & associated dq signals t dqsq ? 240 ps 17) ck half pulse width t hp min( t ch.abs , t cl.abs ) __ ps 18) dq hold skew factor t qhs ? 340 ps 19) dq/dqs output hold time from dqs t qh t hp ? t qhs ?ps 20) write command to dqs associated clock edges wl rl?1 nck dqs latching rising transition to associated clock edges t dqss ? 0.25 + 0.25 t ck.avg 21) dqs input high pulse width t dqsh 0.35 ? t ck.avg dqs input low pulse width t dqsl 0.35 ? t ck.avg dqs falling edge to ck setup time t dss 0.2 ? t ck.avg 1) dqs falling edge hold time from ck t dsh 0.2 ? t ck.avg 1) write postamble t wpst 0.4 0.6 t ck.avg write preamble t wpre 0.35 ? t ck.avg address and control input setup time t ls.base 200 ? ps 22)23) address and control input hold time t lh.base 275 ? ps 1)24) read preamble t rpre 0.9 1.1 t ck.avg 25)26) read postamble t rpst 0.4 0.6 t ck.avg 1)27) active to precharge command t ras 45 70000 ns 28) active to active command period for 1kb page size products t rrd 7.5 ? ns 1) active to active command period for 2kb page size products t rrd 10 ? ns 1) internet data sheet rev. 1.01, 2006-09 20 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules four activate window for 1kb page size products t faw 37.5 ? ns 1) four activate window for 2kb page size products t faw 50 ? ns 1) cas to cas command delay t ccd 2?nck write recovery time t wr 15 ? ns 1) auto-precharge write recovery + precharge time t dal wr + t nrp ?nck 29)30) internal write to read command delay t wtr 7.5 ? ns 1)31) internal read to precharge command delay t rtp 7.5 ? ns 1) exit self-refresh to a non-read command t xsnr t rfc +10 ? ns 1) exit self-refresh to read command t xsrd 200 ? nck exit precharge power-down to any valid command (other than nop or deselect) t xp 2?nck exit power down to read command t xard 2?nck exit active power-down mode to read command (slow exit, lower power) t xards 7 ? al ? nck cke minimum pulse width ( high and low pulse width) t cke 3?nck 32) odt turn-on delay t aond 22nck odt turn-on t aon t ac.min t ac.max +0.7 ns 1)33) odt turn-on (power down mode) t aonpd t ac.min +2 2 x t ck.avg + t ac.max +1 ns odt turn-off delay t aofd 2.5 2.5 nck odt turn-off t aof t ac.min t ac.max +0.6 ns 34)35) odt turn-off (power down mode) t aofpd t ac.min + 2 2.5 x t ck.avg + t ac.max +1 ns odt to power down entry latency t anpd 3??nck odt to power down exit latency t axpd 8nck mode register set command cycle time t mrd 2?nck mrs command to odt update delay t mod 012ns 1) ocd drive mode output delay t oit 012ns 1) minimum time clocks remain on after cke asynchronously drops low t delay t ls + t ck .avg + t lh ?? ns 1) for details and notes see the relevant qimonda component data sheet 2) v ddq = 1.8 v 0.1v; v dd = 1.8 v 0.1 v. see notes 1)1)1)1) 3) timing that is not specified is ille gal and after such an event, in order to guarantee proper operation, the dram must be pow ered down and then restarted through the specified initializa tion sequence before normal operation can continue. 4) timings are guaranteed with ck/ck differential slew rate of 2.0 v/ns. for dqs si gnals timings are guaranteed with a differential slew rate of 2.0 v/ns in differential strobe mode and a slew rate of 1 v/ns in single ended mode. 5) the ck / ck input reference level (for timing reference to ck / ck ) is the point at which ck and ck cross. the dqs / dqs , rdqs / rdqs , input reference level is the crosspoint when in differential strobe mode. 6) inputs are not recognized as valid until v ref stabilizes. during the period before v ref stabilizes, cke = 0.2 x v ddq is recognized as low. 7) the output timing reference voltage level is v tt . parameter symbol ddr2?667 unit note 1)2)3)4)5)6)7) 8) min. max. internet data sheet rev. 1.01, 2006-09 21 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 8) new units, ? t ck.avg ? and ?nck?, are introduced in ddr2?667 and ddr2?800. unit ? t ck.avg ? represents the actual t ck.avg of the input clock under operation. unit ?nck? represents one clock cycle of the i nput clock, counting the actual clock edges. note that in ddr2?4 00 and ddr2?533, ? t ck ? is used for both concepts. example: t xp = 2 [nck] means; if power down exit is registered at tm, an active command may be registered at tm + 2, even if (tm + 2 - tm) is 2 x t ck.avg + t err.2per(min) . 9) when the device is operated with input clock jitter, this parameter needs to be derated by the actual t err(6-10per) of the input clock. (output deratings are relative to the sdram input clock.) for ex ample, if the measured jitter into a ddr2?667 sdram has t err(6-10per).min = ? 272 ps and t err(6- 10per).max = + 293 ps, then t dqsck.min(derated) = t dqsck.min ? t err(6-10per).max = ? 400 ps ? 293 ps = ? 693 ps and t dqsck.max(derated) = t dqsck.max ? t err(6-10per).min = 400 ps + 272 ps = + 672 ps. similarly, t lz.dq for ddr2?667 derates to t lz.dq.min(derated) = - 900 ps ? 293 ps = ? 1193 ps and t lz.dq.max(derated) = 450 ps + 272 ps = + 722 ps. (caution on the min/max usage!) 10) input clock jitter spec parameter. these parameters are referr ed to as 'input clock jitter s pec parameters' and these parame ters apply to ddr2?667 and ddr2?800 only. the jitter specified is a random jitter meeting a gaussian distribution. 11) these parameters are specified per their average values, howe ver it is understood that the relationship between the average timing and the absolute instantaneous timing holds all the times (min. and max of spec values are to be used for calculations). 12) input waveform timing t ds with differential data strobe enabled mr[bit10] = 0, is referenced from the input signal crossing at the v ih.ac level to the differential data strobe crosspoint for a ri sing signal, and from the input signal crossing at the v il.ac level to the differential data strobe crosspoint for a falling signal applied to the devic e under test. dqs, dqs signals must be monotonic between v il(dc)max and v ih(dc)min . see figure 3 . 13) if t ds or t dh is violated, data corruption may occur and the data must be re -written with valid data before a valid read can be executed. 14) these parameters are measured from a data signal ((l/u)dm, (l/u)dq0, (l/u)dq1, etc.) transition edge to its respective data strobe signal ((l/u/r)dqs / dqs ) crossing. 15) input waveform timing t dh with differential data strobe enabled mr[bit10] = 0, is refe renced from the differential data strobe crosspoint to the input signal crossing at the v ih.dc level for a falling signal and from the differential data strobe crosspoint to the input signal crossing at the v il.dc level for a rising signal applied to the device under test. dqs, dqs signals must be monotonic between v il.dc.max and v ih.dc.min . see figure 3 . 16) t hz and t lz transitions occur in the same access time as valid data trans itions. these parameters are refe renced to a specific voltage lev el which specifies when the device output is no longer driving ( t hz ), or begins driving ( t lz ) . 17) t dqsq : consists of data pin skew and output pattern effects, and p-c hannel to n-channel variation of the output drivers as well as o utput slew rate mismatch between dqs / dqs and associated dq in any given cycle. 18) t hp is the minimum of the absolute half period of the actual input clock. t hp is an input parameter but not an input specification parameter. it is used in conjunction with t qhs to derive the dram output timing t qh . the value to be used for t qh calculation is determined by the following equation; t hp = min ( t ch.abs , t cl.abs ), where, t ch.abs is the minimum of the actual instantaneous clock high time; t cl.abs is the minimum of the actual in stantaneous clock low time. 19) t qhs accounts for: 1) the pulse duration distortion of on-ch ip clock circuits, which repr esents how well the actual t hp at the input is transferred to the output; and 2) the worst case push-out of dq s on one transition followed by the worst case pull-in of dq on the next transition, both of which are independent of each other, due to data pin skew, output pattern effects, and pchannel to n-channe l variation of the output drivers. 20) t qh = t hp ? t qhs , where: t hp is the minimum of the absolute half period of the actual input clock; and t qhs is the specification value under the max column. {the less half-pulse width distortion present, the larger the t qh value is; and the larger the valid data eye will be.} examples: 1) if the system provides t hp of 1315 ps into a ddr2?667 sdram, the dram provides t qh of 975 ps minimum. 2) if the system provides t hp of 1420 ps into a ddr2?667 sdram, the dram provides t qh of 1080 ps minimum. 21) these parameters are measured from a data strobe signal ((l/u/r)dqs / dqs ) crossing to its respec tive clock signal (ck / ck ) crossing. the spec values are not affected by t he amount of clock jitter applied (i.e. t jit.per , t jit.cc , etc.), as these are relative to the clock signal crossing. that is, these param eters should be met whether clock jitter is present or not. 22) input waveform timing is referenced from the input signal crossing at the v ih.ac level for a rising signal and v il.ac for a falling signal applied to the device under test. see figure 4 . 23) these parameters are measured from a command/address signal (c ke, cs, ras, cas, we, odt, ba0, a0, a1, etc.) transition edge to its respective clock signal (ck / ck ) crossing. the spec values are not affect ed by the amount of cl ock jitter applied (i.e. t jit.per , t jit.cc , etc.), as the setup and hold are relative to the clock signal cr ossing that latches the command/address. that is, these paramet ers should be met whether clock jitter is present or not. 24) input waveform timing is referenced from the input signal crossing at the v il.dc level for a rising signal and v ih.dc for a falling signal applied to the device under test. see figure 4 . 25) t rpst end point and t rpre begin point are not referenced to a specific voltage level but specify when the device output is no longer driving ( t rpst ), or begins driving ( t rpre ). figure 2 shows a method to calculate these points when the device is no longer driving ( t rpst ), or begins driving ( t rpre ) by measuring the signal at two different voltages. the actual voltage measurement poi nts are not critical as long as the calculation is consistent. 26) when the device is operated with i nput clock jitter, this parameter needs to be derated by the actual t jit.per of the input clock. (output deratings are relative to the sdram input clock.) for example, if the measured jitter into a ddr2?667 sdram has t jit.per.min = ? 72 ps and t jit.per.max = + 93 ps, then t rpre.min(derated) = t rpre.min + t jit.per.min = 0.9 x t ck.avg ? 72 ps = + 2178 ps and t rpre.max(derated) = t rpre.max + t jit.per.max = 1.1 x t ck.avg + 93 ps = + 2843 ps. (caution on the min/max usage!). internet data sheet rev. 1.01, 2006-09 22 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules figure 2 method for calculating transitions and endpoint 27) when the device is operated with i nput clock jitter, this parameter needs to be derated by the actual t jit.duty of the input clock. (output deratings are relative to the sdram input clock.) for ex ample, if the measured jitter into a ddr2?667 sdram has t jit.duty.min = ? 72 ps and t jit.duty.max = + 93 ps, then t rpst.min(derated) = t rpst.min + t jit.duty.min = 0.4 x t ck.avg ? 72 ps = + 928 ps and t rpst.max(derated) = t rpst.max + t jit.duty.max = 0.6 x t ck.avg + 93 ps = + 1592 ps. (caution on the min/max usage!). 28) for these parameters, the ddr2 sdram device is characterized and verified to support t nparam = ru{ t param / t ck.avg }, which is in clock cycles, assuming all input cl ock jitter specifications are satisfied. for example, the device will support t nrp = ru{ t rp / t ck.avg }, which is in clock cycles, if all input clock jitter specifications are me t. this means: for ddr2?667 5?5?5, of which t rp = 15 ns, the device will support t nrp = ru{ t rp / t ck.avg } = 5, i.e. as long as the input cloc k jitter specifications are met, prechar ge command at tm and active command at tm + 5 is valid even if (tm + 5 - tm) is less than 15 ns due to input clock jitter. 29) dal = wr + ru{ t rp (ns) / t ck (ns)}, where ru stands for round up. wr refers to the twr parameter stored in the mrs. for t rp , if the result of the division is not already an integer, round up to the next highest integer. t ck refers to the application clock period. example: for ddr2?533 at t ck = 3.75 ns with t wr programmed to 4 clocks. t dal = 4 + (15 ns / 3.75 ns) clocks = 4 + (4) clocks = 8 clocks. 30) t dal.nck = wr [nck] + t nrp.nck = wr + ru{ t rp [ps] / t ck.avg [ps] }, where wr is the value programmed in the emr. 31) t wtr is at lease two clocks (2 x t ck ) independent of operation frequency. 32) t cke.min of 3 clocks means cke must be registered on three consecutive positive clock edges. cke must remain at the valid input level t he entire time it takes to achieve the 3 clo cks of registration. thus, after any cke tr ansition, cke may not transition from its v alid level during the time period of t is + 2 x t ck + t ih . 33) odt turn on time min is when the device leaves high impedance and odt resistance begins to turn on. odt turn on time max is when the odt resistance is fully on. both are measured from t aond . 34) odt turn off time min is when the device starts to turn off od t resistance. odt turn off time max is when the bus is in high impedance. both are measured from t aofd . 35) when the device is operated with input clock ji tter, this parameter needs to be derated by {? t jit.duty.max ? t err(6-10per).max } and {? t jit.duty.min ? t err(6-10per).min } of the actual input clock. (output deratings are relative to the sdram input clock.) for example, if the measured jitter into a ddr2?667 sdram has t err(6-10per).min = ? 272 ps, t err(6- 10per).max = + 293 ps, t jit.duty.min = ? 106 ps and t jit.duty.max = + 94 ps, then t aof.min(derated) = t aof.min + {? t jit.duty.max ? t err(6-10per).max } = ? 450 ps + {? 94 ps ? 293 ps} = ? 837 ps and t aof.max(derated) = t aof.max + {? t jit.duty.min ? t err(6-10per).min } = 1050 ps + {106 ps + 272 ps} = + 1428 ps. (caution on the min/max usage!) thz trpst end point t1 t2 voh - x mv voh - 2x mv vol + 2x mv vol + x mv tlz trpre begin point t2 t1 vtt + 2x mv vtt + x mv vtt - x mv vtt - 2x mv tlz,trpre begin point = 2*t1-t2 thz,trpst end point = 2*t1-t2 internet data sheet rev. 1.01, 2006-09 23 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules figure 3 differential input waveform timing - t ds and t ds figure 4 differential input waveform timing - t ls and t lh tds v ddq v ih(ac) min v ih(dc) min v ref(dc) v il(dc) max v il(ac) max v ss dqs dqs tdh tds tdh tis v ddq v ih(ac) min v ih(dc) min v ref(dc) v il(dc) max v il(ac) max v ss ck ck tih tis tih internet data sheet rev. 1.01, 2006-09 24 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules table 17 timing parameter by speed grade - ddr2?533 parameter symbol ddr2?533 unit note 1)2)3)4)5) 6)7) min. max. dq output access time from ck / ck t ac ?500 +500 ps cas a to cas b command period t ccd 2? t ck ck, ck high-level width t ch 0.45 0.55 t ck cke minimum high and low pulse width t cke 3? t ck ck, ck low-level width t cl 0.45 0.55 t ck auto-precharge write recovery + precharge time t dal wr + t rp ? t ck 8)21) minimum time clocks remain on after cke asynchronously drops low t delay t is + t ck + t ih ?? ns 9) dq and dm input hold time (differential data strobe) t dh (base) 225 ?? ps 10) dq and dm input hold time (single ended data strobe) t dh1 (base) ?25 ? ps 11) dq and dm input pulse width (each input) t dipw 0.35 ? t ck dqs output access time from ck / ck t dqsck ?450 + 450 ps dqs input low (high) pulse width (write cycle) t dqsl,h 0.35 ? t ck dqs-dq skew (for dqs & associated dq signals) t dqsq ? 300 ps 11) write command to 1st dqs latching transition t dqss ? 0.25 + 0.25 t ck dq and dm input setup time (differential data strobe) t ds (base) 100 ? ps 11) dq and dm input setup time (single ended data strobe) t ds1 (base) ?25 ? ps 11) dqs falling edge hold time from ck (write cycle) t dsh 0.2 ? t ck dqs falling edge to ck setup time (write cycle) t dss 0.2 ? t ck four activate window period t faw 37.5 ? ns 50 ? ns 13) clock half period t hp min. ( t cl, t ch ) 12) data-out high-impedance time from ck / ck t hz ? t ac.max ps 13) address and control input hold time t ih (base) 375 ? ps 11) address and control input pulse width (each input) t ipw 0.6 ? t ck address and control input setup time t is (base) 250 ? ps 11) dq low-impedance time from ck / ck t lz(dq) 2 t ac.min t ac.max ps 14) dqs low-impedance from ck / ck t lz(dqs) t ac.min t ac.max ps 14) mode register set command cycle time t mrd 2? t ck ocd drive mode output delay t oit 012ns data output hold time from dqs t qh t hp ? t qhs ? internet data sheet rev. 1.01, 2006-09 25 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules data hold skew factor t qhs ? 400 ps average periodic refresh interval t refi ?7.8 s 14)15) ?3.9 s 16)21) auto-refresh to active/auto-refresh command period t rfc 75 ? ns 17) auto-refresh to active/auto-refresh command period t rfc 105 ? ns 18) auto-refresh to active/auto-refresh command period t rfc 127.5 ? ns 19) auto-refresh to active/auto-refresh command period t rfc 197.5 ? ns 20) precharge-all (4 banks) command period t rp t rp +1 t ck ?ns precharge-all (8 banks) command period t rp 15 + 1tck ? ns read preamble t rpre 0.9 1.1 t ck 14) read postamble t rpst 0.40 0.60 t ck 14) active bank a to active bank b command period t rrd 7.5 ? ns 14)21) 10 ? ns 16)23) internal read to precharge command delay t rtp 7.5 ? ns write preamble t wpre 0.25 x t ck ? t ck write postamble t wpst 0.40 0.60 t ck 22) write recovery time for write without auto- precharge t wr 15 ? ns write recovery time for write with auto- precharge wr t wr / t ck t ck 23) internal write to read command delay t wtr 7.5 ? ns 24) exit power down to any valid command (other than nop or deselect) t xard 2? t ck 25) exit active power-down mode to read command (slow exit, lower power) t xards 6 ? al ? t ck 25) exit precharge power-down to any valid command (other than nop or deselect) t xp 2? t ck exit self-refresh to non-read command t xsnr t rfc +10 ? ns exit self-refresh to read command t xsrd 200 ? t ck 1) for details and notes see the relevant qimonda component data sheet 2) v ddq = 1.8 v 0.1 v; v dd = 1.8 v 0.1 v. see notes 5)6)7)8) 3) timing that is not specified is ille gal and after such an event, in order to guarantee proper operation, the dram must be pow ered down and then restarted through the specified initializa tion sequence before normal operation can continue. 4) timings are guaranteed with ck/ck differential slew rate of 2.0 v/ns. for dqs si gnals timings are guaranteed with a differential slew rate of 2.0 v/ns in differential strobe mode and a slew rate of 1 v/ns in single ended mode. 5) the ck / ck input reference level (for timing reference to ck / ck ) is the point at which ck and ck cross. the dqs / dqs , rdqs/ rdqs , input reference level is the crosspoint when in differential strobe mode. 6) inputs are not recognized as valid until v ref stabilizes. during the period before v ref stabilizes, cke = 0.2 x v ddq is recognized as low. 7) the output timing reference voltage level is v tt . parameter symbol ddr2?533 unit note 1)2)3)4)5) 6)7) min. max. internet data sheet rev. 1.01, 2006-09 26 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 8) for each of the terms, if not already an integer, round to the next highest integer. t ck refers to the application clock period. wr refers to the wr parameter stored in the mr. 9) the clock frequency is allowed to change during self-refresh mode or precharge power-down mode. 10) for timing definition, refer to the component data sheet. 11) consists of data pin skew and output pattern effects, and p-c hannel to n-channel variation of t he output drivers as well as output slew rate mis-match between dqs / dqs and associated dq in any given cycle. 12) min ( t cl , t ch ) refers to the smaller of the actual clock low time and the act ual clock high time as provided to the device (i.e. this value can be greater than the minimum specification limits for t cl and t ch ). 13) the t hz , t rpst and t lz , t rpre parameters are referenced to a specific voltage level, which specify when the device output is no longer driving ( t hz, t rpst ), or begins driving ( t lz, t rpre ). t hz and t lz transitions occur in the same access time windows as valid da ta transitions.these parameters are verified by design and characteri zation, but not subject to production test. 14) the auto-refresh command interval has be reduced to 3.9 s when operating the ddr2 dram in a temperature range between 85 c and 95 c. 15) 0 c t case 85 c 16) 85 c < t case 95 c 17) a maximum of eight auto-refresh commands can be posted to any given ddr2 sdram device. 18) a maximum of eight auto-refresh commands can be posted to any given ddr2 sdram device. 19) a maximum of eight auto-refresh commands can be posted to any given ddr2 sdram device. 20) a maximum of eight auto-refresh commands can be posted to any given ddr2 sdram device. 21) the t rrd timing parameter depends on the page size of the dram organization. see. 22) the maximum limit for the t wpst parameter is not a device limit. t he device operates with a greater value for this parameter, but system performance (bus turnaround) degrades accordingly. 23) wr must be programmed to fulfill the minimum requirement for the t wr timing parameter, where wr min [cycles] = t wr (ns)/ t ck (ns) rounded up to the next integer value. t dal = wr + ( t rp / t ck ). for each of the terms, if not already an integer, round to the next highest integer. t ck refers to the application clock period. wr refers to the wr parameter stored in the mrs. 24) minimum t wtr is two clocks when operating the ddr2-sdram at frequencies 200 ? z. 25) user can choose two different active pow er-down modes for additional power saving vi a mrs address bit a12. in ?standard acti ve power- down mode? (mr, a12 = ?0?) a fast power-down exit timing t xard can be used. in ?low active power-down mode? (mr, a12 =?1?) a slow power-down exit timing t xards has to be satisfied. internet data sheet rev. 1.01, 2006-09 27 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules table 18 timing parameter by speed grade - ddr2-400 parameter symbol ddr2?400 unit note 1)2)3)4)5) 6)7) min. max. dq output access time from ck / ck t ac ?600 +600 ps cas a to cas b command period t ccd 2? t ck ck, ck high-level width t ch 0.45 0.55 t ck cke minimum high and low pulse width t cke 3? t ck ck, ck low-level width t cl 0.45 0.55 t ck auto-precharge write recovery + precharge time t dal wr + t rp ? t ck 8)25) minimum time clocks remain on after cke asynchronously drops low t delay t is + t ck + t ih ?? ns 9) dq and dm input hold time (differential data strobe) t dh (base) 275 ?? ps 10) dq and dm input hold time (single ended data strobe) t dh1 (base) ?25 ? ps 11) dq and dm input pulse width (each input) t dipw 0.35 ? t ck dqs output access time from ck / ck t dqsck ?500 + 500 ps dqs input low (high) pulse width (write cycle) t dqsl,h 0.35 ? t ck dqs-dq skew (for dqs & associated dq signals) t dqsq ? 350 ps 11) write command to 1st dqs latching transition t dqss ? 0.25 + 0.25 t ck dq and dm input setup time (differential data strobe) t ds (base) 150 ? ps 11) dq and dm input setup time (single ended data strobe) t ds1 (base) ?25 ? ps 11) dqs falling edge hold time from ck (write cycle) t dsh 0.2 ? t ck dqs falling edge to ck setup time (write cycle) t dss 0.2 ? t ck four activate window period t faw 37.5 ? ns 50 ? ns 13) clock half period t hp min. ( t cl, t ch ) 12) data-out high-impedance time from ck / ck t hz ? t ac.max ps 13) address and control input hold time t ih (base) 475 ? ps 11) address and control input pulse width (each input) t ipw 0.6 ? t ck address and control input setup time t is (base) 350 ? ps 11) dq low-impedance time from ck / ck t lz(dq) 2 t ac.min t ac.max ps 14) dqs low-impedance from ck / ck t lz(dqs) t ac.min t ac.max ps 14) mode register set command cycle time t mrd 2? t ck ocd drive mode output delay t oit 012ns data output hold time from dqs t qh t hp ? t qhs ? internet data sheet rev. 1.01, 2006-09 28 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules data hold skew factor t qhs ? 450 ps average periodic refresh interval t refi ?7.8 s 14)15) ?3.9 s 16)21) auto-refresh to active/auto-refresh command period t rfc 75 ? ns 17) auto-refresh to active/auto-refresh command period t rfc 105 ? ns 18) auto-refresh to active/auto-refresh command period t rfc 127.5 ? ns 19) auto-refresh to active/auto-refresh command period t rfc 197.5 ? ns 20) precharge-all (4 banks) command period t rp t rp +1 t ck ?ns precharge-all (8 banks) command period t rp 15 + 1 t ck ?ns read preamble t rpre 0.9 1.1 t ck 14) read postamble t rpst 0.40 0.60 t ck 14) active bank a to active bank b command period t rrd 7.5 ? ns 14)21) 10 ? ns 16)23) internal read to precharge command delay t rtp 7.5 ? ns write preamble t wpre 0.25 x t ck ? t ck write postamble t wpst 0.40 0.60 t ck 22) write recovery time for write without auto- precharge t wr 15 ? ns write recovery time for write with auto- precharge wr t wr / t ck t ck 23) internal write to read command delay t wtr 10 ? ns 24) exit power down to any valid command (other than nop or deselect) t xard 2? t ck 25) exit active power-down mode to read command (slow exit, lower power) t xards 6 ? al ? t ck 25) exit precharge power-down to any valid command (other than nop or deselect) t xp 2? t ck exit self-refresh to non-read command t xsnr t rfc +10 ? ns exit self-refresh to read command t xsrd 200 ? t ck 1) for details and notes see the relevant qimonda component data sheet 2) v ddq = 1.8 v 0.1 v; v dd = 1.8 v 0.1 v. see notes 5)6)7)8) 3) timing that is not specified is ille gal and after such an event, in order to guarantee proper operation, the dram must be pow ered down and then restarted through the specified initializa tion sequence before normal operation can continue. 4) timings are guaranteed with ck/ck differential slew rate of 2.0 v/ns. for dqs si gnals timings are guaranteed with a differential slew rate of 2.0 v/ns in differential strobe mode and a slew rate of 1 v/ns in single ended mode. 5) the ck / ck input reference level (for timing reference to ck / ck ) is the point at which ck and ck cross. the dqs / dqs , rdqs/ rdqs , input reference level is the crosspoint when in differential strobe mode. 6) inputs are not recognized as valid until v ref stabilizes. during the period before v ref stabilizes, cke = 0.2 x v ddq is recognized as low. 7) the output timing reference voltage level is v tt . parameter symbol ddr2?400 unit note 1)2)3)4)5) 6)7) min. max. internet data sheet rev. 1.01, 2006-09 29 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 3.3.3 odt ac electrical characteristics this chapter contains the odt ac electrical characteristics tables. table 19 odt ac characteristics and operating conditions for ddr2-667 8) for each of the terms, if not already an integer, round to the next highest integer. t ck refers to the application clock period. wr refers to the wr parameter stored in the mr. 9) the clock frequency is allowed to change during self-refresh mode or precharge power-down mode. 10) for timing definition, refer to the component data sheet. 11) consists of data pin skew and output pattern effects, and p-channel to n-channel variation of t he output drivers as well as output slew rate mis-match between dqs / dqs and associated dq in any given cycle. 12) min ( t cl , t ch ) refers to the smaller of the actual clock low time and the ac tual clock high time as provided to the device (i.e. this value can be greater than the minimum specification limits for t cl and t ch ). 13) the t hz , t rpst and t lz , t rpre parameters are referenced to a specific voltage level, which specify when the device output is no longer driving ( t hz, t rpst ), or begins driving ( t lz, t rpre ). t hz and t lz transitions occur in the same access time windows as valid da ta transitions.these parameters are verified by design and characteri zation, but not subject to production test. 14) the auto-refresh command interval has be reduced to 3.9 s when operating the ddr2 dram in a temperature range between 85 c and 95 c. 15) 0 c t case 85 c 16) 85 c < t case 95 c 17) a maximum of eight auto-refresh commands can be posted to any given ddr2 sdram device. 18) a maximum of eight auto-refresh commands can be posted to any given ddr2 sdram device. 19) a maximum of eight auto-refresh commands can be posted to any given ddr2 sdram device. 20) a maximum of eight auto-refresh commands can be posted to any given ddr2 sdram device. 21) the t rrd timing parameter depends on the page size of the dram organization. see . 22) the maximum limit for the t wpst parameter is not a device limit. t he device operates with a greater value for this parameter, but system performance (bus turnaround) degrades accordingly. 23) wr must be programmed to fulfill the minimum requirement for the t wr timing parameter, where wr min [cycles] = t wr (ns)/ t ck (ns) rounded up to the next integer value. t dal = wr + ( t rp / t ck ). for each of the terms, if not already an integer, round to the next highest integer. t ck refers to the application clock period. wr refers to the wr parameter stored in the mrs. 24) minimum t wtr is two clocks when operating the ddr2-sdram at frequencies 200 ? z. 25) user can choose two different active power-down modes for addi tional power saving via mrs address bit a12. in ?standard acti ve power- down mode? (mr, a12 = ?0?) a fast power-down exit timing t xard can be used. in ?low active power-down mode? (mr, a12 =?1?) a slow power-down exit timing t xards has to be satisfied. symbol parameter / condition values unit note min. max. t aond odt turn-on delay 2 2 t ck t aon odt turn-on t ac.min t ac.max + 0.7 ns ns 1) 1) odt turn on time min. is when the devic e leaves high impedance and odt re sistance begins to turn on. odt turn on time max is when the odt resistance is fully on. both are measure from t aond . t aonpd odt turn-on (power-down modes) t ac.min + 2 ns 2 t ck + t ac.max + 1 ns ns t aofd odt turn-off delay 2.5 2.5 t ck t aof odt turn-off t ac.min t ac.max + 0.6 ns ns 2) 2) odt turn off time min. is when the device starts to turn off odt resistance. odt turn off time max is when the bus is in high impedance. both are measured from t aofd . t aofpd odt turn-off (power-down modes) t ac.min + 2 ns 2.5 t ck + t ac.max + 1 ns ns t anpd odt to power down mode entry latency 3 ? t ck t axpd odt power down exit latency 8 ? t ck internet data sheet rev. 1.01, 2006-09 30 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules table 20 odt ac characteristics and operating conditions for ddr2-533 & ddr2-400 symbol parameter / condition values unit note min. max. t aond odt turn-on delay 2 2 t ck t aon odt turn-on t ac.min t ac.max + 1 ns ns 1) 1) odt turn on time min. is when the devic e leaves high impedance and odt re sistance begins to turn on. odt turn on time max is when the odt resistance is fully on. both are measure from t aond . t aonpd odt turn-on (power-down modes) t ac.min + 2 ns 2 t ck + t ac.max + 1 ns ns t aofd odt turn-off delay 2.5 2.5 t ck t aof odt turn-off t ac.min t ac.max + 0.6 ns ns 2) 2) odt turn off time min. is when the device starts to turn off odt resistance. odt turn off time max is when the bus is in high impedance. both are measured from t aofd . t aofpd odt turn-off (power-down modes) t ac.min + 2 ns 2.5 t ck + t ac.max + 1 ns ns t anpd odt to power down mode entry latency 3 ? t ck t axpd odt power down exit latency 8 ? t ck internet data sheet rev. 1.01, 2006-09 31 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 3.4 currents specifications and conditions this chapter describes the specifications and conditions. table 21 i dd measurement conditions parameter symbol note 1)2) 3)4)5)6) operating current 0 one bank active - precharge; t ck = t ck.min , t rc = t rc.min , t ras = t ras.min , cke is high, cs is high between valid commands. address and control inputs are switching, databus inputs are switching. i dd0 operating current 1 one bank active - read - precharge; i out = 0 ma, bl = 4, t ck = t ck.min , t rc = t rc.min , t ras = t ras.min , t rcd = t rcd.min , al = 0, cl = cl min ; cke is high, cs is high between valid commands. address and control inputs are switching, databus inputs are switching. i dd1 precharge standby current all banks idle; cs is high; cke is high; t ck = t ck.min ; other control and address inputs are switching, data bus inputs are switching. i dd2n precharge power-down current other control and address inputs are st able, data bus inputs are floating. i dd2p precharge quiet standby current all banks idle; cs is high; cke is high; t ck = t ck.min ; other control and address inputs are stable, data bus inputs are floating. i dd2q active standby current burst read: all banks open; continuous burst reads; bl = 4; al = 0, cl = cl min ; t ck = t ck.min ; t ras = t ras.max , t rp = t rp.min ; cke is high, cs is high between valid commands. address inputs are switching; data bus inputs are switching; i out = 0 ma. i dd3n active power-down current all banks open; t ck = t ck.min , cke is low; other control and addres s inputs are stable, data bus inputs are floating. mrs a12 bit is se t to low (fast power-down exit); i dd3p(0) active power-down current all banks open; t ck = t ck.min , cke is low; other control and address inputs are stable, data bus inputs are floating. mrs a12 bit is set to high (slow power-down exit); i dd3p(1) operating current burst write: all banks open; continuous burst writes; bl = 4; al = 0, cl = cl min ; t ck = t ck.min ; t ras = t ras.max. , t rp = t rp.max ; cke is high, cs is high between valid commands. address inputs are switching; data bus in puts are switching; i dd4w burst refresh current t ck = t ck.min ., refresh command every t rfc = t rfc.min interval, cke is high, cs is high between valid commands, other control and address inputs ar e switching, data bus inputs are switching. i dd5b distributed refresh current t ck = t ck.min. , refresh command every t rfc = t refi interval, cke is low and cs is high between valid commands, other control and address inputs ar e switching, data bus inputs are switching. i dd5d internet data sheet rev. 1.01, 2006-09 32 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules table 22 definitions for i dd self-refresh current cke 0.2 v; external clock off, ck and ck at 0 v; other control and add ress inputs are floating, data bus inputs are floating. i dd6 current values are guaranteed up to t case of 85 c max. i dd6 all bank interleave read current all banks are being interleaved at minimum t rc without violating t rrd using a burst length of 4. control and address bus inputs are stable during deselects. i out = 0 ma. i dd7 1) v ddq = 1.8 v 0.1 v; v dd = 1.8 v 0.1 v 2) i dd specifications are tested after t he device is properly initialized and i dd parameter are specified with odt disabled. 3) definitions for i dd see table 22 4) i dd1 , i dd4r and i dd7 current measurements are defined with the outputs disabled ( i out = 0 ma). to achieve this on module level the output buffers can be disabled using an emrs(1) (extended m ode register command) by setting a12 bit to high. 5) for two rank modules: for all active current meas urements the other rank is in precharge power-down mode i dd2p 6) for details and notes see the relevant qimonda component data sheet parameter description low v in v il(ac).max , high is defined as v in v ih(ac).min stable inputs are stable at a high or low level floating inputs are v ref = v ddq /2 switching inputs are changing between high and low every ot her clock (once per 2 cycles) for address and control signals, and inputs changing between high and low every other data transfer (once per cycle) for dq signals not including mask or strobes parameter symbol note 1)2) 3)4)5)6) internet data sheet rev. 1.01, 2006-09 33 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules table 23 i dd specification for hys72t[32/64] hp?[3s/3.7]?a product type hys72t32000hp?3s?a HYS72T64001HP?3s?a hys72t64020hp?3s?a hys72t32000hp?3.7?a HYS72T64001HP?3.7?a hys72t64020hp?3.7?a unit note 1) 1) module i dd is calculated on the basis of component i dd and includes currents of registers and pll. odt disabled. i dd1 , i dd4r and i dd7 are defined with the outputs disabled. organization 256 mbyte 512 mbyte 512 mbyte 256 mbyte 512 mbyte 512 mbyte 1 rank 1 rank 2 rank 1 rank 1 rank 2 rank 72 72 72 72 72 72 ?3s ?3s ?3s ?3.7 ?3.7 ?3.7 symbol max. max. max. max. max. max. i dd0 940 1710 990 830 1490 860 ma 2) 2) the other rank is i dd2p precharge power-down standby current mode. i dd1 1020 1870 1070 870 1580 910 ma 2) i dd2n 790 1410 1200 650 1130 960 ma 3) 3) both ranks are in the same i dd mode. i dd2p 430 690 480 370 570 400 ma 3) i dd2q 660 1140 930 560 950 780 ma 3) i dd3n 790 1410 1200 650 1130 960 ma 3) i dd3p.mrs=0 560 940 730 470 790 620 ma 3) i dd3p.mrs=1 430 690 480 370 570 400 ma 3) i dd4r 1380 2580 1420 960 1760 1000 ma 2) i dd4w 1420 2670 1470 1100 2030 1130 ma 2) i dd5b 1240 2310 1290 1100 2030 1130 ma 2) i dd5d 440 700 490 380 610 440 ma 3)4) 4) values for 0 c t case 85 c i dd6 36 72 72 36 72 72 ma 3)4) i dd7 1630 3080 1670 1550 2930 1580 ma 2) internet data sheet rev. 1.01, 2006-09 34 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 3.4.1 currents test conditions for testing the i dd parameters, the following timing parameters are used: table 24 i dd measurement test conditions for ddr2?667 table 25 i dd measurement test conditions for ddr2?533 parameter symbol ?3s unit ddr2?667d cas latency cl (idd) 5 t ck clock cycle time t ck(idd) 3.75 ns active to read or write delay t rcd(idd) 15 ns active to active / auto-refresh command period t rc(idd) 60 ns active bank a to active bank b command delay t rrd(idd) 7.5 ns active to precharge command t ras.min(idd) 45 ns t ras.max(idd) 70000 ns precharge command period t rp(idd) 15 ns average periodic refresh interval t refi 7.8 s parameter symbol ?3.7 unit ddr2?533c cas latency cl (idd) 4 t ck clock cycle time t ck(idd) 3.75 ns active to read or write delay t rcd(idd) 15 ns active to active / auto-refresh command period t rc(idd) 60 ns active bank a to active bank b command delay t rrd(idd) 7.5 ns active to precharge command t ras.min(idd) 45 ns t ras.max(idd) 70000 ns precharge command period t rp(idd) 15 ns average periodic refresh interval t refi 7.8 s internet data sheet rev. 1.01, 2006-09 35 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 3.4.2 on die termination (odt) current the odt function adds additional current consumption to t he ddr2 sdram when enabled by the emrs(1). depending on address bits a[6,2] in the emrs(1) a ?w eak? or ?strong? termination can be sele cted. the current consumption for any terminated input pin, depends on the input pin is in tri-state or driving 0 or 1, as long a odt is enabled during a given perio d of time. table 26 odt current per terminated pin parameter symbol min. typ. max. unit emrs(1) state enabled odt current per dq odt is high; data bu s inputs are floating i odto 5 6 7.5 ma/dq a6 = 0, a2 = 1 2.5 3 3.75 ma/dq a6 = 1, a2 = 0 7.5 9 11.25 ma/dq a6 = 1, a2 = 1 active odt current per dq odt is high; worst case of data bus inputs are stable or switching. i odtt 10 12 15 ma/dq a6 = 0, a2 = 1 5 6 7.5 ma/dq a6 = 1, a2 = 0 15 18 22.5 ma/dq a6 = 1, a2 = 0 internet data sheet rev. 1.01, 2006-09 36 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 4 spd codes this chapter lists all hexadecimal byte values stored in the eeprom of the products described in this data sheet. spd stands for serial presence detect. all values with xx in the table are module specific bytes which are defined during production. list of spd code tables ? table 27 ?spd codes for pc2?5300? on page 36 ? table 28 ?spd codes for pc2?4200? on page 41 table 27 spd codes for pc2?5300 product type hys72t32000hp?3s?a hys72t64000hp?3s?a hys72t64020hp?3s?a organization 256mb 512mb 512mb 72 72 72 1 rank ( 8) 1 rank ( 8) 2 ranks ( 8) label code pc2?5300p?555 pc2?5300p?555 pc2?5300p?555 jedec spd revision rev. 1.2 rev. 1.2 rev. 1.2 byte# description hex hex hex 0 programmed spd bytes in eeprom 80 80 80 1 total number of bytes in eeprom 08 08 08 2 memory type (ddr2) 08 08 08 3 number of row addresses 0d 0e 0d 4 number of column addresses 0a 0a 0a 5 dimm rank and stacking information 60 60 61 6 data width 48 48 48 7 not used 00 00 00 8 interface voltage level 05 05 05 9 t ck @ cl max (byte 18) [ns] 30 30 30 10 t ac sdram @ cl max (byte 18) [ns] 45 45 45 11 error correction support (non-ecc, ecc) 06 06 06 12 refresh rate and type 82 82 82 13 primary sdram width 08 08 08 14 error checking sdram width 08 08 08 internet data sheet rev. 1.01, 2006-09 37 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 15 not used 00 00 00 16 burst length supported 0c 0c 0c 17 number of banks on sdram device 04 04 04 18 supported cas latencies 38 38 38 19 dimm mechanical characteristics 01 01 01 20 dimm type information 01 01 01 21 dimm attributes 04 04 05 22 component attributes 03 03 03 23 t ck @ cl max -1 (byte 18) [ns] 3d 3d 3d 24 t ac sdram @ cl max -1 [ns] 50 50 50 25 t ck @ cl max -2 (byte 18) [ns] 50 50 50 26 t ac sdram @ cl max -2 [ns] 60 60 60 27 t rp.min [ns] 3c 3c 3c 28 t rrd.min [ns] 1e 1e 1e 29 t rcd.min [ns] 3c 3c 3c 30 t ras.min [ns] 2d 2d 2d 31 module density per rank 40 80 40 32 t as.min and t cs.min [ns] 20 20 20 33 t ah.min and t ch.min [ns] 27 27 27 34 t ds.min [ns] 10 10 10 35 t dh.min [ns] 17 17 17 36 t wr.min [ns] 3c 3c 3c 37 t wtr.min [ns] 1e 1e 1e 38 t rtp.min [ns] 1e 1e 1e 39 analysis characteristics 00 00 00 40 t rc and t rfc extension 000000 41 t rc.min [ns] 3c 3c 3c product type hys72t32000hp?3s?a hys72t64000hp?3s?a hys72t64020hp?3s?a organization 256mb 512mb 512mb 72 72 72 1 rank ( 8) 1 rank ( 8) 2 ranks ( 8) label code pc2?5300p?555 pc2?5300p?555 pc2?5300p?555 jedec spd revision rev. 1.2 rev. 1.2 rev. 1.2 byte# description hex hex hex internet data sheet rev. 1.01, 2006-09 38 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 42 t rfc.min [ns] 4b 69 4b 43 t ck.max [ns] 80 80 80 44 t dqsq.max [ns] 18 18 18 45 t qhs.max [ns] 22 22 22 46 pll relock time 0f 0f 0f 47 t case.max delta / ? t 4r4w delta 525352 48 psi(t-a) dram 82 78 82 49 ? t 0 (dt0) 43 4b 43 50 ? t 2n (dt2n, udimm) or ? t 2q (dt2q, rdimm) 25 2e 25 51 ? t 2p (dt2p) 29 26 29 52 ? t 3n (dt3n) 25 26 25 53 ? t 3p.fast (dt3p fast) 2f 2b 2f 54 ? t 3p.slow (dt3p slow) 19 1b 19 55 ? t 4r (dt4r) / ? t 4r4w sign (dt4r4w) 44 4a 44 56 ? t 5b (dt5b) 17 20 17 57 ? t 7 (dt7) 222222 58psi(ca) pll c4c4c4 59 psi(ca) reg 8c 8c 8c 60 ? t pll (dtpll) 68 68 68 61 ? t reg (dtreg) / toggle rate 94 94 94 62 spd revision 12 12 12 63 checksum of bytes 0-62 d5 47 d7 64 manufacturer?s jedec id code (1) 7f 7f 7f 65 manufacturer?s jedec id code (2) 7f 7f 7f 66 manufacturer?s jedec id code (3) 7f 7f 7f 67 manufacturer?s jedec id code (4) 7f 7f 7f 68 manufacturer?s jedec id code (5) 7f 7f 7f product type hys72t32000hp?3s?a hys72t64000hp?3s?a hys72t64020hp?3s?a organization 256mb 512mb 512mb 72 72 72 1 rank ( 8) 1 rank ( 8) 2 ranks ( 8) label code pc2?5300p?555 pc2?5300p?555 pc2?5300p?555 jedec spd revision rev. 1.2 rev. 1.2 rev. 1.2 byte# description hex hex hex internet data sheet rev. 1.01, 2006-09 39 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 69 manufacturer?s jedec id code (6) 51 51 51 70 manufacturer?s jedec id code (7) 00 00 00 71 manufacturer?s jedec id code (8) 00 00 00 72 module manufacturer location xx xx xx 73 product type, char 1 37 37 37 74 product type, char 2 32 32 32 75 product type, char 3 54 54 54 76 product type, char 4 33 36 36 77 product type, char 5 32 34 34 78 product type, char 6 30 30 30 79 product type, char 7 30 30 32 80 product type, char 8 30 30 30 81 product type, char 9 48 48 48 82 product type, char 10 50 50 50 83 product type, char 11 33 33 33 84 product type, char 12 53 53 53 85 product type, char 13 41 41 41 86 product type, char 14 20 20 20 87 product type, char 15 20 20 20 88 product type, char 16 20 20 20 89 product type, char 17 20 20 20 90 product type, char 18 20 20 20 91 module revision code 2x 2x 2x 92 test program revision code xx xx xx 93 module manufacturing date year xx xx xx 94 module manufacturing date week xx xx xx 95 - 98 module serial number xx xx xx product type hys72t32000hp?3s?a hys72t64000hp?3s?a hys72t64020hp?3s?a organization 256mb 512mb 512mb 72 72 72 1 rank ( 8) 1 rank ( 8) 2 ranks ( 8) label code pc2?5300p?555 pc2?5300p?555 pc2?5300p?555 jedec spd revision rev. 1.2 rev. 1.2 rev. 1.2 byte# description hex hex hex internet data sheet rev. 1.01, 2006-09 40 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 99 - 127 not used 00 00 00 128 - 255 blank for customer use ff ff ff product type hys72t32000hp?3s?a hys72t64000hp?3s?a hys72t64020hp?3s?a organization 256mb 512mb 512mb 72 72 72 1 rank ( 8) 1 rank ( 8) 2 ranks ( 8) label code pc2?5300p?555 pc2?5300p?555 pc2?5300p?555 jedec spd revision rev. 1.2 rev. 1.2 rev. 1.2 byte# description hex hex hex internet data sheet rev. 1.01, 2006-09 41 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules table 28 spd codes for pc2?4200 product type hys72t32000hp?3.7?a hys72t64000hp?3.7?a hys72t64020hp?3.7?a organization 256mb 512mb 512mb 72 72 72 1 rank ( 8) 1 rank ( 8) 2 ranks ( 8) label code pc2?4200p?444 pc2?4200p?444 pc2?4200p?444 jedec spd revision rev. 1.2 rev. 1.2 rev. 1.2 byte# description hex hex hex 0 programmed spd bytes in eeprom 80 80 80 1 total number of bytes in eeprom 08 08 08 2 memory type (ddr2) 08 08 08 3 number of row addresses 0d 0e 0d 4 number of column addresses 0a 0a 0a 5 dimm rank and stacking information 60 60 61 6 data width 48 48 48 7 not used 00 00 00 8 interface voltage level 05 05 05 9 t ck @ cl max (byte 18) [ns] 3d 3d 3d 10 t ac sdram @ cl max (byte 18) [ns] 50 50 50 11 error correction support (non-ecc, ecc) 06 06 06 12 refresh rate and type 82 82 82 13 primary sdram width 08 08 08 14 error checking sdram width 08 08 08 15 not used 00 00 00 16 burst length supported 0c 0c 0c 17 number of banks on sdram device 04 04 04 18 supported cas latencies 38 38 38 19 dimm mechanical characteristics 01 01 01 20 dimm type information 01 01 01 21 dimm attributes 04 04 05 22 component attributes 03 03 03 23 t ck @ cl max -1 (byte 18) [ns] 3d 3d 3d internet data sheet rev. 1.01, 2006-09 42 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 24 t ac sdram @ cl max -1 [ns] 50 50 50 25 t ck @ cl max -2 (byte 18) [ns] 50 50 50 26 t ac sdram @ cl max -2 [ns] 60 60 60 27 t rp.min [ns] 3c 3c 3c 28 t rrd.min [ns] 1e 1e 1e 29 t rcd.min [ns] 3c 3c 3c 30 t ras.min [ns] 2d 2d 2d 31 module density per rank 40 80 40 32 t as.min and t cs.min [ns] 25 25 25 33 t ah.min and t ch.min [ns] 37 37 37 34 t ds.min [ns] 10 10 10 35 t dh.min [ns] 22 22 22 36 t wr.min [ns] 3c 3c 3c 37 t wtr.min [ns] 1e 1e 1e 38 t rtp.min [ns] 1e 1e 1e 39 analysis characteristics 00 00 00 40 t rc and t rfc extension 000000 41 t rc.min [ns] 3c 3c 3c 42 t rfc.min [ns] 4b 69 4b 43 t ck.max [ns] 80 80 80 44 t dqsq.max [ns] 1e 1e 1e 45 t qhs.max [ns] 28 28 28 46 pll relock time 0f 0f 0f 47 t case.max delta / ? t 4r4w delta 555155 48 psi(t-a) dram 82 78 82 49 ? t 0 (dt0) 37 3f 37 50 ? t 2n (dt2n, udimm) or ? t 2q (dt2q, rdimm) 1f 22 1f product type hys72t32000hp?3.7?a hys72t64000hp?3.7?a hys72t64020hp?3.7?a organization 256mb 512mb 512mb 72 72 72 1 rank ( 8) 1 rank ( 8) 2 ranks ( 8) label code pc2?4200p?444 pc2?4200p?444 pc2?4200p?444 jedec spd revision rev. 1.2 rev. 1.2 rev. 1.2 byte# description hex hex hex internet data sheet rev. 1.01, 2006-09 43 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 51 ? t 2p (dt2p) 21 1e 21 52 ? t 3n (dt3n) 1d 1e 1d 53 ? t 3p.fast (dt3p fast) 282428 54 ? t 3p.slow (dt3p slow) 141714 55 ? t 4r (dt4r) / ? t 4r4w sign (dt4r4w) 2c 34 2c 56 ? t 5b (dt5b) 15 1e 15 57 ? t 7 (dt7) 212021 58psi(ca) pll c4c4c4 59 psi(ca) reg 8c 8c 8c 60 ? t pll (dtpll) 61 61 61 61 ? t reg (dtreg) / toggle rate 78 78 78 62 spd revision 12 12 12 63 checksum of bytes 0-62 b0 19 b2 64 manufacturer?s jedec id code (1) 7f 7f 7f 65 manufacturer?s jedec id code (2) 7f 7f 7f 66 manufacturer?s jedec id code (3) 7f 7f 7f 67 manufacturer?s jedec id code (4) 7f 7f 7f 68 manufacturer?s jedec id code (5) 7f 7f 7f 69 manufacturer?s jedec id code (6) 51 51 51 70 manufacturer?s jedec id code (7) 00 00 00 71 manufacturer?s jedec id code (8) 00 00 00 72 module manufacturer location xx xx xx 73 product type, char 1 37 37 37 74 product type, char 2 32 32 32 75 product type, char 3 54 54 54 76 product type, char 4 33 36 36 77 product type, char 5 32 34 34 product type hys72t32000hp?3.7?a hys72t64000hp?3.7?a hys72t64020hp?3.7?a organization 256mb 512mb 512mb 72 72 72 1 rank ( 8) 1 rank ( 8) 2 ranks ( 8) label code pc2?4200p?444 pc2?4200p?444 pc2?4200p?444 jedec spd revision rev. 1.2 rev. 1.2 rev. 1.2 byte# description hex hex hex internet data sheet rev. 1.01, 2006-09 44 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 78 product type, char 6 30 30 30 79 product type, char 7 30 30 32 80 product type, char 8 30 30 30 81 product type, char 9 48 48 48 82 product type, char 10 50 50 50 83 product type, char 11 33 33 33 84 product type, char 12 2e 2e 2e 85 product type, char 13 37 37 37 86 product type, char 14 41 41 41 87 product type, char 15 20 20 20 88 product type, char 16 20 20 20 89 product type, char 17 20 20 20 90 product type, char 18 20 20 20 91 module revision code 2x 2x 2x 92 test program revision code xx xx xx 93 module manufacturing date year xx xx xx 94 module manufacturing date week xx xx xx 95 - 98 module serial number xx xx xx 99 - 127 not used 00 00 00 128 - 255 blank for customer use ff ff ff product type hys72t32000hp?3.7?a hys72t64000hp?3.7?a hys72t64020hp?3.7?a organization 256mb 512mb 512mb 72 72 72 1 rank ( 8) 1 rank ( 8) 2 ranks ( 8) label code pc2?4200p?444 pc2?4200p?444 pc2?4200p?444 jedec spd revision rev. 1.2 rev. 1.2 rev. 1.2 byte# description hex hex hex internet data sheet rev. 1.01, 2006-09 45 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 5 package outlines this chapter contains the package outlines of the products. figure 5 package outline raw card f l-dim-240-11 notes 1. general tolerances +/- 0.15 2. drawing according to iso 8015 * / ' % & $ & ? 0 $ ; % ? % x u u p d [ d o o r z h g ? $ % & ' h w d l o r i f r q w d f w v ? $ ? [ internet data sheet rev. 1.01, 2006-09 46 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules figure 6 package outline raw card g l-dim-240-12 notes 1. general tolerances +/- 0.15 2. drawing according to iso 8015 * / ' % & $ & ? 0 $ ; % ? % x u u p d [ d o o r z h g ? $ % & ' h w d l o r i f r q w d f w v ? $ ? [ internet data sheet rev. 1.01, 2006-09 47 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules figure 7 package outline raw card h l-dim-240-13 notes 1. general tolerances +/- 0.15 2. drawing according to iso 8015 * / ' % & $ & ? 0 $ ; % ? % x u u p d [ d o o r z h g ? $ % & ' h w d l o r i f r q w d f w v ? $ ? [ internet data sheet rev. 1.01, 2006-09 48 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 6 product type nomenclature qimonda?s nomenclature uses simple coding combined with some propriatory coding. table 29 provides examples for module and component product type number as well as the field number. the detailed field description together with possible values and coding explanation is listed for modules in table 30 and for components in table 31 . table 29 nomenclature fields and examples table 30 ddr2 dimm nomenclature example for field number 1234567891011 micro-dimm hys 64 t 64/128 0 2 0 k m ?5 ?a ddr2 dram hyb 18 t 512/ 16 0 a c ?5 field description values coding 1 qimonda module prefix hys constant 2 module data width [bit] 64 non-ecc 72 ecc 3 dram technology t ddr2 4 memory density per i/o [mbit]; module density 1) 32 256 mbyte 64 512 mbyte 128 1 gbyte 256 2 gbyte 512 4 gbyte 5 raw card generation 0 .. 9 look up table 6 number of module ranks 0, 2, 4 1, 2, 4 7 product variations 0 .. 9 look up table 8 package, lead-free status a .. z look up table 9 module type d so- d imm m m icro-dimm r r egistered u u nbuffered f f ully buffered internet data sheet rev. 1.01, 2006-09 49 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules table 31 ddr2 dram nomenclature 10 speed grade ?2.5f pc2?6400 5?5?5 ?2.5 pc2?6400 6?6?6 ?3 pc2?5300 4?4?4 ?3s pc2?5300 5?5?5 ?3.7 pc2?4200 4?4?4 ?5 pc2?3200 3?3?3 11 die revision ?a first ?b second 1) multiplying ?memory density per i/o? with ?module data width? and dividing by 8 for non-ecc and 9 for ecc modules gives the o verall module memory density in mbytes as listed in column ?coding?. field description values coding 1 qimonda component prefix hyb constant 2 interface voltage [v] 18 sstl_18 3 dram technology t ddr2 4 component density [mbit] 256 256 mbit 512 512 mbit 1g 1 gbit 2g 2 gbit 5+6 number of i/os 40 4 80 8 16 16 7 product variations 0 .. 9 look up table 8 die revision a first b second 9 package, lead-free stat us c fbga, lead-containing f fbga, lead-free 10 speed grade ?25f ddr2-800 5-5-5 ?2.5 ddr2-800 6-6-6 ?3 ddr2-667 4-4-4 ?3s ddr2-667 5-5-5 ?3.7 ddr2-533 4-4-4 ?5 ddr2-400 3-3-3 field description values coding internet data sheet rev. 1.01, 2006-09 50 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules table 1 performance table for ?3s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 table 2 performance table for ?3.7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 table 3 performance table for ?5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 table 4 ordering information for rohs compliant products. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 table 5 address format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 table 6 components on modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 7 pin configuration of rdimm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 8 abbreviations for buffer type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 9 abbreviations for pin type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 10 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 table 11 dram component operating temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 table 12 operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 table 13 supply voltage levels and dc operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 table 14 speed grade definition speed bins for ddr2?667d. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 table 15 speed grade definition speed bins for ddr2?533c. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 table 16 timing parameter by speed grade - ddr2?667 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 table 17 timing parameter by speed grade - ddr2?533 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 18 timing parameter by speed grade - ddr2-400 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 table 19 odt ac characteristics and operating conditions for ddr2-667. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 table 20 odt ac characteristics and operating conditions for ddr2-533 & ddr2-400 . . . . . . . . . . . . . . . . . . . . . . . 30 table 21 i dd measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 table 22 definitions for i dd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 table 23 i dd specification for hys72t[32/64] hp?[3s/3.7]?a . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 table 24 i dd measurement test conditions for ddr2?667 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 table 25 i dd measurement test conditions for ddr2?533 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 table 26 odt current per terminated pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 table 27 spd codes for pc2?5300 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 table 28 spd codes for pc2?4200 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 table 29 nomenclature fields and examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 table 30 ddr2 dimm nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 table 31 ddr2 dram nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 list of tables internet data sheet rev. 1.01, 2006-09 52 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules figure 1 pin configuration for rdimm (240 pins) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 2 method for calculating transitions and endpoint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 figure 3 differential in put waveform timing - t ds and t ds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 figure 4 differential in put waveform timing - t ls and t lh . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 figure 5 package outline raw card f l-dim-240-11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 figure 6 package outline raw card g l-dim-240- 12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 figure 7 package outline raw card h l-dim-240 -13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 list of figures internet data sheet rev. 1.01, 2006-09 53 03292006-zzhp-pr83 hys72t[32/64]xxxhp?[3s/3.7]?a registered ddr2 sdram modules 1 overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.2 dc operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.3 ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.3.1 speed grades definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.3.2 ac timing parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.3.3 odt ac electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 3.4 currents specifications and conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 3.4.1 currents test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.4.2 on die termination (odt) current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 4 spd codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 5 package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 6 product type nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 list of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 list of figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 table of contents edition 2006-09 published by qimonda ag gustav-heinemann-ring 212 d-81739 mnchen, germany ? qimonda ag 2006. all rights reserved. legal disclaimer the information given in this internet data sheet shall in no ev ent be regarded as a guarantee of conditions or characteristics (?beschaffenheitsgarantie?). with respect to any examples or hi nts given herein, any typical values stated herein and/or any information regarding the application of the device, qimonda hereby disclaims any and all warranties and liabilities of any kin d, including without limitation warranties of non-infringem ent of intellectual property rights of any third party. information for further information on technology, delivery terms and conditio ns and prices please contact your nearest qimonda office. warnings due to technical requirements components may contain dangerous substances. for information on the types in question please contact your nearest qimonda office. qimonda components may only be used in life-support devices or systems with the express writte n approval of qimonda, if a failure of such components can reasonably be expected to cause the failure of that life-support devi ce or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is re asonable to assume that the he alth of the user or other persons may be endangered. www.qimonda.com internet data sheet |
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